Staff Package Design Engineer
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Job Description
We are looking for a Package Design Engineer to join our advanced silicon packaging design and simulation team and contribute to the design and delivery of high‑performance 2.5D/3D, chiplet‑based, FCBGA, SiP, wire bond and QFP/QFN packages used in industry‑leading products. The role requires strong technical depth in package layout execution, manufacturability, and cross‑domain co‑design with silicon, SI/PI, thermal, and reliability teams.
Key Responsibilities
• Perform package layout design and development for advanced packages including 2.5D/3D IC, FCBGA, SiP, and multi‑chip modules.
• Develop and maintain package CAD databases, ensuring accuracy and adherence to design guidelines, Design for Manufacturing (DFM), and Design for Assembly (DFA) requirements to ensure producibility.
• Manage end-to-end design cycle, including schematic creation, netlist import, footprint assignment, and generation of manufacturing outputs (Gerbers, drill data, fabrication/assembly drawings).
• Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.
• Work closely with SI/PI, thermal, reliability, and DFT teams to support co‑design and optimization and participate in design reviews.
• Ensure designs comply with foundry, OSAT, and manufacturing design rules (DRC, LVS).
• Support ECO cycles, design updates, and version control throughout the project lifecycle.
Requirements
Function: Engineering
Experience Level: Mid-Senior Level