Principal Package Design Engineer
Job Description
We are seeking a Senior Advanced Packaging Engineer to lead the development and integration of next-generation packaging solutions for high-performance semiconductors and electronic products. This role will focus on advanced package architectures, assembly processes, thermal and mechanical reliability, and cross-functional collaboration with design, manufacturing, suppliers, and quality teams. The ideal candidate has deep expertise in semiconductor packaging technologies and a strong track record of bringing complex products from concept through qualification and high-volume production.
Responsibilities
• Lead the design, development, and qualification of advanced semiconductor packaging solutions, including:• Flip-chip, Chip Embedding
• Wafer-level packaging (WLP/FOWLP)
• Panel-level packaging (laminate, molding)
• 2.5D/3D packaging
• System-in-package (SiP)
• Ball grid array (BGA/CSP)
• Define package architecture based on electrical, thermal, mechanical, reliability, and cost requirements.
• Drive package technology selection and development for new product introductions.
• Work closely with IC design, substrate, board, thermal, reliability, and manufacturing teams to ensure package compatibility and performance.
• Oversee package layout reviews, stack-up definition, material selection, and interconnect strategy.
• Perform and guide simulations and analysis related to:• Signal integrity / power integrity
• Thermal performance
• Mechanical stress / warpage
• Design for manufacturability (DFM)
• Develop assembly flows and process requirements for OSATs and manufacturing partners.
• Lead package qualification activities, including DOE planning, failure analysis, and reliability testing.
• Resolve packaging-related issues during NPI prototype builds, qualification, and production ramp.
• Collaborate with suppliers and internal/external manufacturing partners on process improvements, material evaluation, and yield optimization.
• Create and maintain package specifications, design rules, process documentation, and technical reports.
• Mentor junior engineers and provide technical leadership across packaging initiatives.
Requirements
Function: Engineering
Experience Level: Mid-Senior Level