Thin Film Processing Engineer
Job Description
• Responsible for sustaining the vacuum thin film deposition using PVD/IBD processes, and characterize thin film properties, such as XRF, XRR, TEM, BH-Looper, and other magnetic properties.
• Responsible to analyze the wafer processing and probing results. To correlate the wafer probing results to wafer individual processing steps and materials to create action items and recommendations to resolve the production yield and quality issues.
• To perform and/or coordinate wafer level failure analysis activities related to reader thin film deposition processes, such as TEM analysis, wafer level SPC audit to identify possible root causes for all released products.
• Work with advanced reader development group to transfer new deposition processes into production as well as qualify new tools.
Requirements
Function: Engineering
Experience Level: Mid-Senior Level